中文

Journal of Applied Sciences ›› 2006, Vol. 24 ›› Issue (2): 213-217.

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Mechanical Property Test of Polyimide/SiO2 Film in Polyimide Regeneration Studies

DONG E-liang1, KANG Xin2, LIN Bao-ping3, HE Xiao-yuan1, WANG Feng-quan1   

  1. 1. Department of Engineering Mechanics, Southeast University, Nanjing 210096, China;
    2. Department of Mechanics and Engineering Science, Nanjing University of Science and Technology, Nanjing 210094, China;
    3. Department of Chemical Engineering, Southeast University, Nanjing 210096, China
  • Received:2004-11-06 Revised:2005-06-20 Online:2006-03-31 Published:2006-03-31

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Abstract: The test method of dynamic mechanical thermal analysis (DMTA) is discussed.Measurement of mechanical properties of the polyimide/SiO2 film using the digital speckle correlation method (DSCM) is proposed.Sub-pixel search and bilinear interpolation are used in digital image processing.As DSCM cannot be used directly in measuring large deformation, an improved multilevel DSCM is proposed.Results of Young's modulus obtained with the two methods are compared.

Key words: film, mechanical property, polyimide/SiO2, dynamic mechanical thermal analysis (DMTA), digital speckle correlation method (DSCM)

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