Journal of Applied Sciences ›› 1987, Vol. 5 ›› Issue (1): 72-78.

• Articles • Previous Articles     Next Articles

RESEARCHES ON InP OHMIC CONTACT

WU DINGFEN1, WANG DENING1, ZHANG JUN2   

  1. 1. Shanghai Institute of Metallurgy, Academia Sinica;
    2. Shanghai Watch and Clock Research Institute
  • Received:1984-01-13 Revised:1984-05-26 Online:1987-03-31 Published:1987-03-31

Abstract: The values of specific contact resistance (p0) for both Au/n-InP and Au/p-InP have been calculated theoretically based on the carrier transport study of metal-semiconductor systems. The results, which are presented graphically, show the dependence of p0 on impurity concentration from 1018 to 1021cm-3, and the barrier height from 0.3~1.0 eV. It is found that the Schottky barrier height (φB) would not be changed with annealing temperature below 350℃ in 3 min. When the annealing temperature is higher than 350℃, a poor ohmic contact will be formed in the case of Au/n-InP system, but for Au/n-InP system, only a reduction of φB will be observed. It is determined that an obvious alloying takes place at about 350℃. The computed theoretical results are used to interpret the experimental data of Au Zn/p-InP ohmic contact published in the literatures and the problems exist in our p-type ohmio contact technology are discussed.