应用科学学报 ›› 1983, Vol. 1 ›› Issue (4): 361-368.

• 论文 • 上一篇    下一篇

硅全离子注入的GaAs双栅MESFET

王渭源1, 卢建国1, 乔墉1, 周永泉1, 夏冠群1, 邵永富1, 杨新民1, 陈自姚1, 罗潮渭1, 詹千宝1, 王文骐2   

  1. 1. 中国科学院上海冶金研究所;
    2. 上海科技大学分部
  • 收稿日期:1982-02-08 修回日期:1982-03-23 出版日期:1983-12-31 发布日期:1983-12-31

A MODIFIED HONIZONTAL GARADIENT-FREEZE APPREACH TO THE GROWTH OF FULLY SILICON-IMPLATED GaAs DUAL-GATE MESFET

WANG WEIYUAN1, LU JIANGUO1, QIAO YONG1, ZHOU YONGQUAN1, XIA GUANQUN1, SHAO YONGFU1, YAN XINMIN1, CHEN ZIYAO1, LUO CHAOWEI1, ZAN QIANBAO1, WANG WENQI2   

  1. 1. Shanghai Institute of Metallurgy, Academia Sinica;
    2. Shanghai University of Science and Technology, Branch
  • Received:1982-02-08 Revised:1982-03-23 Online:1983-12-31 Published:1983-12-31

摘要: 本文研究了硅全离子注入的平面型GaAs双栅MESFET.有源层注入条件为110ke V、3.5×1012cm-2,接触层注入条件为50keV、8×1012cm-2,退火条件为800℃30分钟.FET的铝栅1.5×300μm,Au-Ge-Ni为欧姆接触.

Abstract: In this paper, we report on a fully Silicon-implanted planar GaAs dual-gate MESFET. The energy and dose used in the implantation for the active layer were 110keV and 3.5×1012cm-2 respectively, and for the contact layer, were 50keV and ε×1012 cm-2 respectively. After implantation, all the samples were annealed at 800℃ for 30 minutes. Aluminium gates of 1.5×300μm and Au-Ge-Ni ohmic contact were used. The devices were packaged in simple ceramic or plastic packages.