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应用科学学报 ›› 1993, Vol. 11 ›› Issue (4): 316-320.

• 论文 • 上一篇    下一篇

Cu(Ⅱ)-EDTA-HCHO化学镀铜体系的动力学研究

谈明伟1, 徐敏2   

  1. 1. 上海科学技术大学;
    2. 上海新华轴承厂
  • 收稿日期:1991-08-22 修回日期:1992-06-15 出版日期:1993-12-31 发布日期:1993-12-31

KINETIC STUDIES OF Cu(Ⅱ)-EDTA-HCHO ELECTROLESS COPPER PLATING SYSTEM

TAN MINGWEI1, XU MIN2   

  1. 1. Shanghai University of Science and Technology;
    2. Shanghai Xinhua Bearing Factory
  • Received:1991-08-22 Revised:1992-06-15 Online:1993-12-31 Published:1993-12-31

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111

被引次数

1

摘要： 利用一能使化学镀铜过程的阴极和阳极反应分别在不同电极上进行的装置测量了阴、阳极的"短路电流",并以此电流近似地表示化学镀铜的速度,由"短路电流"随时间的变化推导了化学镀铜过程中阴极区反应物种的表面浓度的变化规律,并以此得到了计算稳态时化学镀铜速率的表达式.同时,有关化学镀铜过程的机理也被推断.

关键词: 化学镀铜的动力学, 表面浓度

Abstract: The kinetic behavior of the cathodic reaction and the anodic reaction during Cu(Ⅱ)-EDTA-HOHO electroless copper plating has been investigated. The dependence of surface concentration of CuEDTA2-, which is reduced to form copper and covered on specimen, on plating time has been determined. The values of stable plating rate calculated from the equation expressing the relation between the stable plating rate and the equilibrium surface concentration of OuEDTA2- are quite consistent with the corresponding measured values. Finally the actual reaction order of electroless copper plating has also been obtained.

Key words: kinetic of electrolegs copper plating, surface concentration