English

应用科学学报 ›› 1998, Vol. 16 ›› Issue (1): 51-55.

• 论文 • 上一篇    下一篇

MCM互连延时宏模型和物理参数

来金梅, 林争辉   

  1. 上海交通大学
  • 收稿日期:1996-05-10 修回日期:1996-07-07 出版日期:1998-03-31 发布日期:1998-03-31
  • 作者简介:来金梅:讲师,上海交通大学大规模集成电路研究所,上海 200030
  • 基金资助:
    国家九五重点科技攻关项目

Macromodel of MCM Interconnection Delay and Its Physical Scaling

LAI JINMEI, LIN ZHENGHUI   

  1. Large Scale Integration Institute, Shanghai Jiaotong University, Shanghai 200030
  • Received:1996-05-10 Revised:1996-07-07 Online:1998-03-31 Published:1998-03-31

PDF

72

被引次数

2

摘要： 该文给出了MCM互连延时的宏模型.用此宏模型研究了延时与MCM互连物理参数的关系,得出芯片之间的平均距离、负载数是影响MCM性能的重要参数.

关键词: 宏模型, 延时, 物理参数, MCM

Abstract: Macromodel of MCM interconnection delay is developed in this paper. With this model it is shown that the most important parameters dominating the performance of MCMs are the average distance between the chips and the size of the load capacitance.

Key words: MCM, macromodel, interconnection delay, physical parameters