Abstract: The kinetic behavior of the cathodic reaction and the anodic reaction during Cu(Ⅱ)-EDTA-HOHO electroless copper plating has been investigated. The dependence of surface concentration of CuEDTA^2-, which is reduced to form copper and covered on specimen, on plating time has been determined. The values of stable plating rate calculated from the equation expressing the relation between the stable plating rate and the equilibrium surface concentration of OuEDTA^2- are quite consistent with the corresponding measured values. Finally the actual reaction order of electroless copper plating has also been obtained.

Key words: kinetic of electrolegs copper plating, surface concentration