Journal of Applied Sciences ›› 1998, Vol. 16 ›› Issue (1): 51-55.
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LAI JINMEI, LIN ZHENGHUI
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Abstract: Macromodel of MCM interconnection delay is developed in this paper. With this model it is shown that the most important parameters dominating the performance of MCMs are the average distance between the chips and the size of the load capacitance.
Key words: MCM, macromodel, interconnection delay, physical parameters
LAI JINMEI, LIN ZHENGHUI. Macromodel of MCM Interconnection Delay and Its Physical Scaling[J]. Journal of Applied Sciences, 1998, 16(1): 51-55.
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https://www.jas.shu.edu.cn/EN/Y1998/V16/I1/51
