大面积HFCVD系统衬底温度场建模与分析

Journal of Applied Sciences ›› 2003, Vol. 21 ›› Issue (4): 423-426.

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Modeling and Analyzing the Substrate Temperature Field in the Large Area Hot-Filament CVD System

SONG Sheng-li^1,2, ZUO Dun-wen¹, WANG Min¹

1. College of Mechanical and Electrical Engineering, NUAA, Nanjing 210016, China;
2. Engineering Institute of Engineer's Corps, PLAUST, Nanjing 210007, China

Received:2002-08-27 Revised:2002-11-01 Online:2003-12-10 Published:2003-12-10

Abstract

Abstract: In this paper, the substrate temperature field is modelled by using heat transfer theory to study the large area hot filament CVD system. In order to meet the requirement for proper magnitude and uniformity of the substrate temperature during the formation of the diamond film, the work to optimize the parameters of the substrate temperature field is performed. Sensitivity analysis is then used to search the key factor which deeply influences the substrate temperature field.

Key words: HFCVD, temperature field, diamond film, sensitivity

CLC Number:

TQ164.8
O781

SONG Sheng-li, ZUO Dun-wen, WANG Min. Modeling and Analyzing the Substrate Temperature Field in the Large Area Hot-Filament CVD System[J]. Journal of Applied Sciences, 2003, 21(4): 423-426.

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Modeling and Analyzing the Substrate Temperature Field in the Large Area Hot-Filament CVD System

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