应用科学学报 ›› 1995, Vol. 13 ›› Issue (3): 352-358.

• 论文 • 上一篇    下一篇

动态集成电路的光声分层成像

方健文1, 张淑仪2, 程建春2, 张仲宁2   

  1. 1. 浙江师范大学;
    2. 南京大学
  • 收稿日期:1993-09-21 修回日期:1993-11-26 出版日期:1995-09-30 发布日期:1995-09-30

PHOTOACOUSTIC LAYERED IMAGING OF DYNAMIC INTEGRATED CIRCUTS

FANG JIANWEN1, ZHANG SHUYI2, CHENG JIANCHUN2, ZHANG ZHONGNING2   

  1. 1. Zhejiang Normal University;
    2. Nanjing University
  • Received:1993-09-21 Revised:1993-11-26 Online:1995-09-30 Published:1995-09-30

摘要: 利用压电光声技术,对处于工作状态的集成电路器件进行了光声分层成像。同时,在理论上研究了动态集成电路的光声分层成像机理,结果表明,动态器件的光声分层成像,不仅可以突出显示器件中某些一般不易观察到的亚表面结构,而且还可研究器件的工作原理以及分析器件动态失效的原因。显示了动态光声分层成像在半导体领域的应用前景。

关键词: 分层成像, 光声技术, 动态集成电路

Abstract: The depth profiling of piezoelectric photoacoustic (PA) imaging of the dynamic integrated circuis (IC) has been studied experimentally and theoretically. A one-dimensional model is proposed to study the influence of the external DC electric field on the PA depth profiling and to explain the experimental results. It is found that the PA layered imaging of dynamic IC devices can be used not only to study the subsurface features but also to analyze the working principles and the failure factors of the IC devices.It is demonstrated that PA layered imaging of dynamicIC devices will have important application prospects.

Key words: dynamic integrated circuits, layered imaging, photoacoustic technique