应用科学学报 ›› 2001, Vol. 19 ›› Issue (4): 291-294.

• 论文 • 上一篇    下一篇

硅基多层无机驻极体薄膜中平均电荷重心和密度的确定

张晓青1, 夏钟福1, 张冶文1, 柳襄怀2   

  1. 1. 同济大学物理系波耳固体物理研究所, 上海 200092;
    2. 中国科学院上海冶金研究所, 上海 200050
  • 收稿日期:2000-11-01 修回日期:2001-01-08 出版日期:2001-12-31 发布日期:2001-12-31
  • 作者简介:张晓青(1972-),女,陕西西安人,博士生;夏钟福(1939-),男,安徽肥东人,教授,博导.
  • 基金资助:
    国家自然科学基金资助项目(59682003);中科院离子束开放实验室课题资助项目(硼离子注入对薄膜驻极体性能的改善)

Determinations of Mean Charge Depth and Charge Density in Electret Based on Silicon Substrate

ZHANG Xiao-qing1, XIA Zhong-fu1, ZHANG Ye-wen1, LIU Xiang-huai2   

  1. 1. Pohl Institute of Solid State Physics. Tongji University, Shanghai 200092, China;
    2. Shanghai Institute of Metallurgy, Academia Sinica, Shanghai 200050, China
  • Received:2000-11-01 Revised:2001-01-08 Online:2001-12-31 Published:2001-12-31

摘要: 报道通过表面电位测量和C-V分析来确定硅基多层无机驻极体薄膜中平均电荷重心及电荷密度的方法.它包括两个非破坏性的测量:首先,通过补偿法测量驻极体薄膜自由面的表面电位,然后在样品表面蒸镀金属电极,形成MIS结构,进行电容电压(C-V)测试,由此得到驻极体薄膜和硅界面的电位.电荷重心和电荷密度可通过计算得出.同时利用这一方法确定了硅基Si3N4/SiO2双层驻极体薄膜中的平均电荷重心,发现电荷重心强烈地依赖于电晕充电以后的老化温度,经过400℃下老化20min,常温正电晕充电驻极体的电荷重心已从近自由面迁移至Si3N4和SiO2界面附近.

关键词: 平均电荷重心, 电荷密度, 驻极体, 薄膜

Abstract: In this paper, a method for determining the mean charge depth and equivalent surface charge density in an electret-semiconductor system is presented. It consists of two nondestructive measurements. Firstly, the surface potential at the electret-air interface is measured by the compensation method. Secondly, using a contacting front electrode, a metal insulator semiconductor structure (MIS) is formed, on which C-V measurement is carried out. The mean charge depth and the charge density can be calculated. The method was applied to the electret double layers of Si3N4/SiO2 based on silicon substrate. It was found that the annealing temperature influences the mean charge depth markedly. The mean charge depth of the sample positively charged at room temperature shifted to the interface of Si3N4 and SiO2 from the free surface after annealed at 400℃ for 20 minutes.

Key words: electret, film, charge density, mean charge depth

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