Abstract: The depth profiling of piezoelectric photoacoustic (PA) imaging of the dynamic integrated circuis (IC) has been studied experimentally and theoretically. A one-dimensional model is proposed to study the influence of the external DC electric field on the PA depth profiling and to explain the experimental results. It is found that the PA layered imaging of dynamic IC devices can be used not only to study the subsurface features but also to analyze the working principles and the failure factors of the IC devices.It is demonstrated that PA layered imaging of dynamicIC devices will have important application prospects.

Key words: dynamic integrated circuits, layered imaging, photoacoustic technique